Printed Circuit Board Manufacturing and Assembly
A PCB (Printed Circuit Board) consists of thin strips of a conducting material such as copper or aluminum which have been etched from a layer fixed to a flat insulating sheet of laminate, and to which integrated circuits and other components are attached. Materials used to manufacture PCBs range from paper epoxy(CEM-1) to glass impregnated FR4 high Tg materials. The Tg rating of a PCB material can determine the temperate a PCB can withstand before delamination starts taking place. The glass transition(Tg) temperature should be determined using the Thermo-Mechanical Analysis (TMA) method as per IPC-TM-650.
Understanding Valiant Electronics Successes in Printed Circuit Boards manufacturing and assembly
We start by understanding the customer application and confirmation that the right material(Tg) is being used. We run design rule check on customer circuit board designs to ensure that trace/space/width, holes size, exposed copper, solder mask, legend/silkscreen etc are within our manufacturing capability and there is no non-conformity. From here a manufacturing instruction is created and travel along with the PCB as it runs through the manufacturing process. This manufacturing instruction detail every specification and tolerances of the PCB as it go through the manufacturing process.
Performance and inspection documents used by Valiant Electronics
IPC-A-600: Acceptance of Printed Wiring Boards
IPC-6011: Generic Performance Specification for Printed Boards
IPC-6013: Specification for Printed Wiring, Flexible and Rigid-Flex
IPC- 6202 IPC/JPCA: Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
PAS-62123: Performance Guide Manual for Single & Double Sided Flexible Printed Wiring Boards
IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards
Classifications Classes
Accept and/or reject decisions shall be based on applicable documentation such as contracts, drawings, specifications, standards and reference documents. Criteria defined in this document reflect three classes, which are as follows:
Class 1: General Electronic Products
Includes products suitable for applications where the major requirement is a function of the completed assembly.
Class 2: Dedicated Service Electronic Products
Includes products where continued performance and extended life is required, and for which uninterrupted service
is desired but not critical. Typically the end-use environment would not cause failures.
Class 3: High Performance Electronic Products
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems.
Quality Management System
Valiant Electronics believes in order to manufacture good quality PCBs consistently, good quality management systems must be implemented. Our PCB factories gained certification in ISO9002:1994, QS9000, ISO9001:2008 and ISO/TS16949:2009. These quality systems allow us to have a strong quality awareness for all our employees since we have to follow standard procedures in order to ensure the highest quality products for our customers.
| – | Proto-type | Mass-production |
|---|---|---|
| Single-sided | 3 days | 10 days |
| Double-sided | 4 days | 15 days |
| Multi-layers | 7 days | 30 days |
Valiant Electronics Printed Circuit Board Manufacturing Capability
| Features | Description | mm | mils | inches |
| Max Layer Count | 36 Layers | ` | ` | ` |
| Max Board Size | 1100mm*610mm | – | – | 43″ x 24″ |
| Min Board Thickness | 0.2 mm | 0.200 | 7.874 | 0.008 |
| Max Board Thickness | 12 mm | 12.000 | 472.441 | 0.472 |
| Min Core Thickness | 0.025 mm | 0.025 | 0.984 | 0.001 |
| Min Dielectric | 0.002″ Inches(0.058mm) | ` | ` | ` |
| Min. Starting Copper Foil Weight | 0.5 oz Copper | ` | ` | ` |
| Max. Finished Copper Thickness (Outer Layer) | 12 oz Copper | ` | ` | ` |
| Max. Finished Copper Thickness (Inner Layer) | 4 oz Copper | ` | ` | ` |
| Smallest Mech Drill Diameter | 0.2 mm | 0.200 | 7.874 | 0.008 |
| Smallest Laser Drill Diameter | 0.1 mm | 0.100 | 3.937 | 0.004 |
| Min Finished Hole Size | 0.1 mm | ` | ` | ` |
| Max Thru-Hole Aspect Ratio | 0.667361111 | ` | ` | ` |
| Max Blind Via Aspect Ratio | 3.125694444 | ` | ` | ` |
| Blind Vias Finished Hole Size Minimum | 0.1 mm | 0.100 | 3.937 | 0.004 |
| Buried Vias Finished Hole Size Minimum | 0.1 mm | 0.100 | 3.937 | 0.004 |
| Min Line Wide/Line Spacing | 0.075 mm | 0.075 | 2.953 | 0.003 |
| Min Pad Size | 0.127 mm | 0.127 | 5.000 | 0.005 |
| Controlled Impedance Tolerance | +/-5% | ` | ` | ` |
| Solder Mask Registration | 0.0762 mm | 0.076 | 3.000 | 0.003 |
| Solder Mask Feature Tolerance | 0.058 mm | 0.058 | 2.283 | 0.002 |
| Solder Mask Min Dam Size | 0.100 mm | 0.100 | 3.937 | 0.004 |
| Min. Diameter Rout Cutter Available | 0.6096 mm | 0.610 | 24.000 | 0.024 |
| Routed Part Size Tolerance | +/-0.203 mm | 0.203 | 7.992 | 0.008 |
| Bow & Twist Tolerance | +/-7% | ` | ` | ` |
| Thickness Tolerance | +/-10% | ` | ` | ` |
| Technology | Blind Vias | ` | ` | ` |
| – | Buried Vias | ` | ` | ` |
| – | Laser Drilling | ` | ` | ` |
| – | Controlled Impedance | ` | ` | ` |
| Surface Finishes | HASL (Vertical or Horizontal) | ` | ` | ` |
| – | Lead-Free HASL | ` | ` | ` |
| – | OSP (Entek) | ` | ` | ` |
| – | ENIG | ` | ` | ` |
| – | Immersion Silver | ` | ` | ` |
| – | Immersion Tin | ` | ` | ` |
| – | Tin Nickel | ` | ` | ` |
| – | Electrolytic Soft Gold | ` | ` | ` |
| – | Electrolytic Hard Gold | ` | ` | ` |
| – | Selective Gold | ` | ` | ` |
| – | Carbon | ` | ` | ` |
| Solder Masks | Semi-Gloss Green | ` | ` | ` |
| – | Gloss Green | ` | ` | ` |
| – | Matte – Green | ` | ` | ` |
| – | Black | ` | ` | ` |
| – | Red | ` | ` | ` |
| – | Blue | ` | ` | ` |
| – | Yellow | ` | ` | ` |
| Legend/Silkscreen | Most colors are available | ` | ` | ` |
| PCB Routing Finishes | Routed Array | ` | ` | ` |
| – | V Score | ` | ` | ` |
| – | Countersink | ` | ` | ` |
| – | Counterbore | ` | ` | ` |
| – | Bevel | ` | ` | ` |
| – | Milling | ` | ` | ` |
| Available Reports | Microsection | ` | ` | ` |
| – | Solderability | ` | ` | ` |
| – | X-ray Fluorescence | ` | ` | ` |
| – | Ionic Contamination | ` | ` | ` |
| – | First Article Inspection | ` | ` | ` |
| – | Certificate of Compliance (C of C) | ` | ` | ` |
| – | PPAP Report | ` | ` | ` |
| UL | 94VO | ` | ` | ` |
| PCB Classifications | IPC 6012, Class 1, 2 & 3 | ` | ` | ` |
| ISO 9001:2000 | ` | ` | ` | |
| Standard Material | FR4(KingBoard) | ` | ` | ` |
| – | FR4(Shengyi) | ` | ` | ` |
| – | FR4(Rogers) | ` | ` | ` |
| – | FR4(Isola) | ` | ` | ` |
| – | High Frequency(Getek) | ` | ` | ` |
| – | Metal Clad PCB(high temperature PCBs) | ` | ` | ` |
| – | Ceramic PCB(really high temperature PCBs) | ` | ` | ` |
| – | Tg170 | ` | ` | ` |
| – | Tg150 | ` | ` | ` |
| – | Tg140 | ` | ` | ` |
| – | Tg130 | ` | ` | ` |
| – | Teflon | ` | ` | ` |
| – | Aluminum-Based | ` | ` | ` |
| – | CEM-1 | ` | ` | ` |
| – | CEM-3 | ` | ` | ` |
| Software Used | Mentor Graphics, Protel, DXP, Spice, OrCad, Pads, CAM350, Eagle PCB | ` | ` | ` |