HDI PCB (High Density Interconnect Printed Circuit Board)
Valiant Electronics is constantly working to improve our technological capabilities to meet the demand for more complex circuit boards. Below you can find our push to improve our technological capability.
HDI PCB :
| Item | 2014 | 2015~2016 | 2017~2019 | |||
| Volume | Sample | Volume | Sample | Volume | Sample | |
| Layer count | 32 | 42 | 38 | 44 | 42 | 48 |
| Min Line/space (μm) | 50/50 | 40/45 | 40/45 | 40/40 | 35/40 | 35/35 |
| Min drill hole diameter (mm) |
0.15 | 0.10 | 0.15 | 0.10 | 0.15 | 0.10 |
| Aspect ratio of PTH |
14:1 | 16:1 | 16:1 | 18:1 | 18:1 | 20:1 |
| N+C+N | 4+C+4 | 5+C+5 | 5+C+5 | 6+C+6 | 5+C+5 | 6+C+6 |
| Any layer interconnection | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 |
| Plate filling via | YES | — | YES | — | YES | — |
| Min. core thickness (exclude copper) (μm) | 50 | 40 | 40 | 30 | 40 | 30 |
| Min. Laser Drill diameter (μm) | 75 | 65 | 65 | 50 | 50 | 40 |
| Via on buried hole/stacked via |
YES | — | YES | — | YES | — |
| Material | FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. | |||||
| Embedded capacitor PCB | YES | — | YES | — | YES | — |
| Surface Process | Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, Peelable solder mask, Carbon ink |
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